Bambu Lab Textured PEI Plate
Brand: BAMBU LAB |
SKU: FAP007 |
Compatibility: X1,P1 & A1 Series |
Considerations
- Increasing heatbed temperature enhances adhesion. Users need to adjust the temperature of the heatbed based on their specific requirements in order to achieve the most suitable level of adhesion.
- Before auto-leveling, it is necessary to repeatedly rub the nozzle in the special wiping area of the build plate to completely remove any residual material at the tip of the nozzle. The coating in the special-designed wiping area will gradually become worn over time. This is normal and does not affect print quality or nozzle lifetime, so there is no need to worry about any quality issues.
- Deposition of dust and grease on the build plate decrease adhesion. It is recommended to regularly clean the surface with detergent and water to to maintain best adhesion.
- Bambu Lab recommends only using Bambu Lab official glue on the Bambu Lab build plates, and can not be held responsible for any damage caused to plates as a result of using third-party glue on build plates. Do not clean the Textured PEI with Acetone, as it will damage the PEI surface.
- Always wait for a few minutes before removing printed models to allow the plate to cool down for easy print removal. This prevents damage to the plate and ensures a long lifetime of the product.
- Carefully sanding the surface with fine-grit (600 was recommended) sandpaper can help restore adhesion.
- The latest firmware brings significant improvements to the Bambu Textured PEI Plate calibration using the Micro Lidar, and it is now fully compatible with the automatic calibration process.
- The Textured PEI plate is considered a consumable part, which will degrade over time. The warranty will only cover manufacturing defects, not cosmetic damage like scratches, dents, or cracks. Defective sheets upon arrival are the only ones covered by the warranty.
Recommended Settings
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
Materials | Heatbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
PLA/PLA-CF/PLA-GF | 45~60℃ | No | Yes |
ABS (not for A1 mini) | 90~100℃ | No | No |
PETG/PETG-CF | 60~80℃ | No | No |
PET-CF (not for A1 mini) | 80~100℃ | No | No |
TPU | 35~45℃ | Yes | Yes |
ASA (not for A1 mini) | 90~100℃ | No | No |
PVA | 45~60℃ | No | Yes |
PC/PC-CF (not for A1 mini) | 90~110℃ | Yes | No |
PA/PA-CF/PAHT-CF (not for A1 mini) | 90~110℃ | Yes | No |