Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate |
| Hotend | All Size / Material | / |
| Glue | Bambu Liquid Glue Glue Stick | / |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C，8 h |
| Printing and Keeping Container's Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 190 - 230 °C |
| Bed Temperature (with Glue) | 35 - 45 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.31 g/cm³ |
| Vicat Softening Temperature | 63 °C |
| Heat Deflection Temperature | 58 °C |
| Melting Temperature | 163 °C |
| Melt Index | 39.4 ± 3.2 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 30 ± 5 MPa |
| Breaking Elongation Rate | 14.8 ± 4.2 % |
| Bending Modulus | 2360 ± 250 MPa |
| Bending Strength | 53 ± 6 MPa |
| Impact Strength | 19.2 ± 3.7 kJ/m² |
